Mediatek Dimensity 9200 Plus Vs Snapdragon 8 Gen 2
Specification Comparison Table | Key-Differences
The Mediatek Dimensity 9200 Plus Vs Snapdragon 8 Gen 2 Specification Comparison – These are two processors from Qualcomm and Mediatek known for their exceptional performance and efficiency. The competition between Mediatek and Qualcomm continues as their latest flagship processors, the Mediatek Dimensity 9200+ Vs Snapdragon 8 Gen 2, are set to go head-to-head in the battle for smartphone dominance.
Both of these processors have been designed with advanced features and capabilities to provide users with top-notch performance and speed.
However, their architecture, manufacturing process, and other features differ, which can impact their performance and user experience.
In this article, we’ll compare the Qualcomm Snapdragon 8 Gen 2 Vs Dimensity 9200 Plus processors, focusing on their features, performance, benchmark scores, and other important aspects.
Whether you’re a tech enthusiast, gamer, or business professional, knowing these differences can help you choose the best smartphone or device for your needs.
You can also check its ranking on the Best Mobile Processor Ranking List. Additionally, you can use our Processor Comparison Tool to compare any processor to another.
Key Differences
| Dimensity 9200 Plus | Snapdragon 8 Gen 2 |
|---|---|
| higher CPU clock speed (3350 vs 3200 MHz) | |
| Supports higher memory bandwidth (68.3 Gbit/s against 64 GB/s) | |
| Better Geekbench Score | |
| Better Antutu Score | |
| Newly launched | |
Qualcomm Snapdragon 8 Gen 2 Vs Dimensity 9200 Plus Which is the best?
The Snapdragon 8 Gen 2 processor is considered better than the Dimensity 9200 Plus due to its superior adaptivity and longevity in the Android market.
However, it’s worth noting that the difference between these two processors is not significant.
MediaTek has done an excellent job with the Dimensity 9200 Plus, as well as previous processors like the Dimensity 9200, 9000, and 9000 Plus, and they are beginning to catch up with Qualcomm.
Mediatek Dimensity 9200 Plus Vs Snapdragon 8 Gen 2 Specification Comparison
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Info
| Manufacturer | Mediatek Qualcomm |
| Announced | 10 May, 2023 15 November, 2022 |
| Model | Dimensity 9200 Plus SM8550-AB |
| Class | Flagship Flagship |
CPU
| Size | 4nm 4nm |
| Cores | 8 8 |
| CPU Configuration | 1x 3.35GHz GHz – Cortex-X3, 3x 3.00 GHz – Cortex-A715, 4x 2.00GHz – Cortex-A510 1 Prime core x 3.2 GHz ARM Cortex-X3 & 4 x 2.8 GHz Cortex-A715 and 3x2.0 GHz Cortex-A510 |
| High Frequency | 3350 MHz 3200 MHz |
| Performance Core | 1x 3.35GHz GHz – Cortex-X3 1 Prime core x 3.2 GHz ARM Cortex-X3 |
| Power Efficient Core | 4x 2.00GHz GHz – Cortex-A510 3x2.0 GHz Cortex-A510 |
| Core architecture | hybrid (Prime big.LITTLE) hybrid (Prime / big.LITTLE) |
| Instruction set | Armv9 Gen-2 CPU ARMv9-A |
| L2 cache | 1 MB 1 MB |
| L3 cache | 8 MB 8 MB |
| Thermal Design Power (TDP) | 8 W |
| Storage Type | UFS 4 + MCQ UFS 4.0 |
GPU
| GPU | Arm Mali-G715 Immortalis MC11 Adreno 740 |
| GPU frequency | 1.00 GHz |
| GPU Architecture | Valhall 3 Adreno 700 |
| FLOPS | 3000 |
| OpenCL Version | 2.0 2.0 |
| DirectX Support | 12 12 |
| Vulkan version | 1.1 1.3 |
| Video Encoding | H.264, HEVC Hybrid Log Gamma (HLG), HDR10+, AV1, H.264 (Advanced Video Coding (AVC)), VP9, VP8, Dolby Vision®, H.265 (High Efficiency Video Coding (HEVC)), HDR10 |
| Video Playback |
H.264, HEVC, VP-9, AV1 Up to 8K @ 60 fps |
| Gaming | MediaTek HyperEngine 6.0 HDR gaming (10-bit color depth, Rec. 2020 color gamut) • Snapdragon Shadow Denoiser |
NPU
| APU / NPU / AI Proc. / Neural IP | Mediatek Neural Engine Qualcomm® Hexagon™ Processor |
| TOPS Speed | - |
| Extra Feature |
- First Snapdragon Mobile Platform with hardware-based micro tile inferencing to run complex neural networks - Dual-core AI processor, Always-sensing camera - Qualcomm® Hexagon™ Processor Features: Qualcomm® Hexagon™ Tensor Accelerator, Dedicated power delivery system, Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Micro Tile Inferencing, Fused AI Accelerator architecture, Hexagon Direct Link |
Memory
| RAM Type | LPDDR5X LPDDR5x |
| RAM frequency | 8533 MHz 4200 MHz |
| RAM Max | 24 GB 24 GB |
| Max Bandwidth | 68.3 Gbit/s 64 Gbit/s |
| Bus Speed | 4x 16 Bit 4x 16 Bit |
Connectivity
| Cellular Modem | Mediatek 5G Modem Snapdragon™ X70 5G Modem-RF System |
| Cellular Technology |
Sub-6GHz (FR1), mmWave (FR2), 2G-5G Multi-Mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM TD-SCDMA, HSPA, sub-6 GHz, FDD, 5G mmWave, NSA (non-standalone), CDMA 1x, EN-DC, EV-DO, CBRS, NR-DC (mmWave-sub6 dual connectivity), TDD, LTE, GSM/EDGE, SA (standalone), SA (standalone) mmWave, WCDMA |
| 5G Modem | |
| 5G Network | 5G/4G Dual SIM Dual Active, SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR FR1 TDD+FDD, DSS, FR1 DL 4CC up to 300 MHz 4x4 MIMO, FR2 DL 4CC up to 400MHz, 256QAM FR1 UL 2CC 2x2 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 256QAM VoNR / EPS fallback 8 carriers (mmWave), 2x2 MIMO (mmWave), 4x4 MIMO (Sub-6) |
| 5G mmWave | |
| 5G sub-6 GHz | |
| Download Speed | Up to 7900 Mbps Up to 10 Gbps |
| Upload Speed | Up to 4200 Mbps Up to 3.5 Gbps |
| Dual SIM | |
| Extra Feature |
Dual SIM Dual Active (DSDA) 5G+5G and 5G+4G, Global 5G Multi-SIM Qualcomm® Smart Transmit 3.0 technology, Qualcomm® AI-Enhanced Signal Boost, Qualcomm® 5G Ultra-Low Latency Suite, Qualcomm® Wideband Envelope Tracking, Qualcomm® 5G AI Suite, Qualcomm® 5G PowerSave Gen 3 |
Wireless System
| wireless System | Mediatek Wireless System Qualcomm® FastConnect™ 7800 |
| Wi-Fi Band | Wi-Fi 7 (a/b/g/n/ac/ax/be) ready 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac, 802.11ax, 802.11be, 6 GHz, 2.4 GHz, 5 GHz |
| WiFi-5 | |
| WiFi-6 | |
| WiFi-6E | |
| Wi-Fi 7 | |
| Download Speed | Up to 5.8 Gbps |
| Bluetooth | Bluetooth® 5.3 Bluetooth® 5.3 |
| GPS | GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC GLONASS, NavIC, Beidou, GPS, QZSS, Galileo |
| USB | USB-C, USB 3.1 USB-C, USB 3.1 |
| NFC | |
| Extra Feature |
Features: Passpoint, TDLS, High Band Simultaneous (HBS) Multi-Link, Wi-Fi QoS Management, Wi-Fi Optimized Connectivity, MU-MIMO (UL/DL), Wi-Fi Aware R3, Wi-Fi Location, OFDMA (UL/DL), Miracast, Voice-Enterprise |
ISP
| ISP | MediaTek Imagiq 890 (First ISP-native RGBW sensor support) Qualcomm® Spectra™ |
| Single Camera | Up to 320MP Up to 108 MP |
| Multi Camera |
Triple Camera (MFNR, ZSL, 30 fps): Up to 36 MP Dual Camera (MFNR, ZSL, 30 fps): Up to 64+36 MP |
| Video capture |
8K30 (7690 x 4320) 4K60 (3840 x 2160) Up to 8K HDR 30fps or 4K 120fps, 720p @ 960 fps Hybrid Log Gamma (HLG), Dolby Vision®, HDR10, HDR10+ |
| Video Codec | H.264, H.265, AV1, VP9 Dolby Vision, HDR10+, HDR10, HLG, H.264 (AVC), H.265 (HEVC), VP8, VP9 |
| Extra Feature | • Up to 200 Megapixel Photo Capture |
Display and Audio Support
| Display Support | Full HD+ up to 240Hz, WQHD up to 144Hz 4K @ 60 Hz • QHD+ @ 144 Hz |
| Refresh Rate | 240Hz 144 Hz |
| Extra Feature |
10-bit color depth, Rec. 2020 color gamut • HDR10, HDR10+, HDR vivid, and Dolby Vision |
| Audio Playback | AAC, AIFF, CAF, MP3, MP4, WAV Qualcomm Aqstic™ audio codec Qualcomm Aqstic™ audio codec |
| Bluetooth Audio | Bluetooth audio: Snapdragon Sound™ Technology with support for Qualcomm® aptX™ Voice, aptX Lossless, aptX Adaptive, and LE Audio |
Security
| Security Features |
Face and Fingerprint Sensor Security certifications from Riscure (Hypervisor, Cryptocore), TUViT (Cryptocore), Thales (BROM). Qualcomm® 3D Sonic Sensor Max, Qualcomm® 3D Sonic Sensor Biometric Authentication (Face), Biometric Authentication (Fingerprint), Biometric Authentication (Voice), Biometric Authentication (Iris) |
| Fingerprint Sensor | |
| Face Detection |
Charging
| Charging Speed | Fast Charging Qualcomm® Quick Charge™ 5 technology |
Benchmarks
| AnTuTu benchmark scores | 1379974 1245135 |
| Geekbench scores |
Single-Core Score - 1510 Multi-Core Score - 5451 Single-Core Score - 1498 Multi-Core Score - 4981 |
| 3DMark | 13243 |
| PCMark | 18915 |
|
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