Qualcomm Snapdragon 8 Gen 3 Vs Dimensity 9000
Dive into the heart of mobile processing as we compare the Qualcomm Snapdragon 8 Gen 3 Vs Dimensity 9000. Witness the evolution of flagship processors, exploring the advancements, benchmark scores, and key features that set these powerhouses apart. Uncover the technological strides and decide which one is better chipset reigns supreme in this head-to-head showdown
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Info
| Manufacturer | Qualcomm Mediatekl |
| Announced | 24 October, 2023 18 November, 2021 |
| Model | SM8650-AB Dimensity 9000 |
| Class | Flagship Flagship |
CPU
| Size | 4nm 4nm |
| Cores | 8 8 |
| CPU Configuration | 1x 3.3 GHz Cortex-X4 Prime core, 5x3.2 GHz Performance -core and 2x2.3 GHz Efficiency-Core 1x Arm Cortex-X2 at 3.05GHz, 3x Arm Cortex-A710 at 2.85GHz and 4x Arm Cortex-A510 at 1.8GHz |
| High Frequency | 3300 MHz 3050 MHz |
| Performance Core | 3.3 GHz Cortex-X4 1x 3.05 GHz – Cortex-X2 |
| Power Efficient Core | 2x 2.27 GHz – Cortex-A520 4x 1.8 GHz – Cortex-A510 |
| Core architecture | hybrid (big.LITTLE) hybrid (Prime / big.LITTLE) |
| Instruction set | ARMv9-A ARMv9-A |
| L1 Cache | 1024 KB |
| L2 cache | 3.5 MB |
| L3 cache | 8 MB |
| Thermal Design Power (TDP) | 4 W |
| Storage Type | UFS 4.0 UFS 3.1 |
GPU
| GPU | Qualcomm® Adreno™ 750 Arm Mali-G710 MC10 |
| GPU frequency | 770 MHz 850 MHz |
| GPU Architecture | Adreno 700 Valhall 3 |
| FLOPS | 4730.8 |
| OpenCL Version | 2.0 2.0 |
| DirectX Support | 12 12 |
| Vulkan version | 1.3 1.1 |
| Shading units | 1536 512 |
| Video Encoding |
Codecs: H.265 (High Efficiency Video Coding (HEVC)), HDR10, Hybrid Log Gamma (HLG), Dolby Vision®, HDR10+, H.264 (Advanced Video Coding (AVC)), VP8, VP9, AV1 H.264, HEVC |
| Video Playback |
Codecs: H.265 (High Efficiency Video Coding (HEVC)), HDR10, Hybrid Log Gamma (HLG), Dolby Vision®, HDR10+, H.264 (Advanced Video Coding (AVC)), VP8, VP9, AV1 H.264, HEVC, VP-9, AV1 |
| Gaming | Snapdragon Elite Gaming™ MediaTek’s HyperEngine 5.0 gaming |
NPU
| APU / NPU / AI Proc. / Neural IP | Qualcomm® AI Engine (Qualcomm® Hexagon™ NPU) MediaTek APU 590 |
| Extra Feature |
Qualcomm® Hexagon™ NPU • Fused AI accelerator architecture • Hexagon scalar, vector, and tensor accelerators • Hexagon Direct Link • Upgraded Micro Tile Inferencing • Upgraded power delivery system • Support for mix precision (INT8+INT16) • Support for all precisions (INT4, INT8, INT16, FP16) |
Memory
| RAM Type | LPDDR5X LPDDR5x |
| RAM frequency | 4800 MHz 3750 MHz |
| RAM Max | 24 GB 16 GB |
| Max Bandwidth | 64 Gbit/s 60 Gbit/s |
| Bus Speed | 4x 16 Bit 4x 16 Bit |
Connectivity
| Cellular Modem | Snapdragon™ X75 5G Modem-RF system Mediatek 5G Modem |
| Cellular Technology |
Cellular Technology: sub-6 GHz, HSPA, TDD, LTE, WCDMA, FDD, SA (standalone), NSA (non-standalone), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE, EN-DC, CBRS, NR-DC (mmWave-sub6 dual connectivity), SA (standalone) mmWave, mmWave 2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA, WDCDMA |
| 5G Modem | |
| 5G Network | 4x4 MIMO (Sub-6), 2x2 MIMO (mmWave), 8 carriers (mmWave) 300MHz bandwidth, 4x4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2x2 MIMO, 256QAM VoNR / EPS fallback |
| 5G mmWave | |
| 5G sub-6 GHz | |
| Download Speed | 10 Gbps 7Gbps |
| Upload Speed | 3.5 Gbps 2.5Gbps |
| Dual SIM | |
| Extra Feature |
Multi SIM: Global 5G Multi-SIM, Dual SIM support Qualcomm® DSDA Gen 2 (Dual Data) |
Wireless System
| wireless System | Qualcomm® FastConnect™ 7800 System Mediatek Wireless System |
| Wi-Fi Band | 802.11be, 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a (6 Ghz, 5 GHz, 2.4 GHz) Wi-Fi 6E (a/b/g/n/ac/ax) |
| WiFi-5 | |
| WiFi-6 | |
| WiFi-6E | |
| Wi-Fi 7 | |
| Download Speed | 5.8 Gbps Wi-Fi 6E (a/b/g/n/ac/ax) |
| Bluetooth | Bluetooth® 5.4 5.3 |
| GPS | Qualcomm® Location Suite (Galileo, Beidou, NavIC, GPS, GLONASS, QZSS) GPS L1CA+L5 / BeiDou B1I+ B2a + B1C / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC |
| USB | Interface Type: USB-C Specification Version: USB 3.1 Gen2 USB-C, USB 3.1 |
| NFC | |
| Extra Feature |
Features: TDLS, Passpoint, High Band Simultaneous (HBS) Multi-Link, Wi-Fi Optimized Connectivity, MU-MIMO (UL/DL), Wi-Fi Aware R3, Wi-Fi QoS Management, Miracast, Wi-Fi Location, OFDMA (UL/DL), Voice-Enterprise, XPAN Technology |
ISP
| ISP | Qualcomm Spectra™ Image Signal Processor •( Cognitive ISP, Triple 18-bit ISPs ) MediaTek Imagiq 790 |
| Single Camera | Up to 200 megapixel photo capture (Up to 108 MP single camera @ 30 FPS with Zero Shutter Lag) 320MP |
| Multi Camera |
. Up to 64+36 MP dual camera @ 30 FPS with Zero Shutter Lag . Up to 36 MP triple camera @ 30 FPS with Zero Shutter Lag 3x 32MP |
| Video capture |
8K HDR video capture @ 30 FPS 4K video capture @ 120 FPS Slow-mo video capture at 720p @ 960 FPS 4K HDR Video + AI-NR |
| Video Codec | Hybrid Log Gamma (HLG), Dolby Vision®, HDR10, HDR10+, Google Ultra HDR H.264, H.265, AV1, VP9 |
| Extra Feature |
Bokeh Engine 2 for video capture Pro Sight video capture 18-bit HDR-ISP fusion up to 9Gpixel/s World’s 1st simultaneous triple camera 18-bit HDR video recording (three cameras recording with three exposures per frame) |
Display and Audio Support
| Display Support | 4K Ultra HD @ 60 Hz, QHD+ @ 144 Hz 144Hz WQHD+ / 180Hz Full HD+ display support |
| Refresh Rate | 144Hz 180Hz |
| Extra Feature |
Maximum External Display Resolution: 8K @ 30 Hz High Dynamic Range (HDR): HDR Vivid, HDR10, HDR10+ Color Depth: 10-bit Color Gamut: Rec. 2020 |
| Audio Playback |
Qualcomm Aqstic™ audio codec, Qualcomm Aqstic™ smart speaker amplifier Audio Processing Technologies: Snapdragon Sound™ technology AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC |
Security
| Security Features |
Qualcomm® 3D Sonic Sensor, Qualcomm® 3D Sonic Sensor Max Secure Processing Unit (SPU): Biometric Authentication (Face), Biometric Authentication (Fingerprint), Biometric Authentication (Iris), Biometric Authentication (Voice) Fingerprint and Face Unlock |
| Fingerprint Sensor | |
| Face Detection |
Charging
| Charging Speed | Qualcomm® Quick Charge™ 5 technology |
Benchmarks
| AnTuTu benchmark scores | 1958738 1010546 |
| Geekbench scores |
Single-Core Score - 2213 Multi-Core Score - 7294 Single-Core Score - 1275 Multi-Core Score - 4314 |
| 3DMark | 16273 8047 |
|
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