The Qualcomm Snapdragon 8 Gen 2 Vs Dimensity 1000 Specification Comparison – These are two processors from Qualcomm and Mediatek known for their exceptional performance and efficiency. Both of these processors have been designed with advanced features and capabilities to provide users with top-notch performance and speed.
In this article, we will delve into a head-to-head comparison between two powerful processors. Join us as we explore the key features, performance capabilities, and technological advancements of the Mediatek Dimensity 1000 Vs Snapdragon 8 Gen 2, and examine how they stack up against each other in the fiercely competitive mobile processor landscape.”
You can also check its ranking on the Best Mobile Processor Ranking List. Additionally, you can use our Processor Comparison Tool to compare any processor to another.
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The Snapdragon 8 Gen 2 is indeed a powerful processor that boasts impressive performance, benchmark results, and a wide range of features. When comparing it to other processors, it stands out in several aspects.
Below, you’ll find a comprehensive table comparing Qualcomm Sd 8 Gen 2 Vs 1000 and their key metrics, revealing the sheer power and capabilities of these cutting-edge processors. Take a moment to review and compare these vital details, enabling you to make an informed decision about which processor aligns best with your needs.
Manufacturer | Qualcomm Mediatek |
Announced | 15 November, 2022 26 November, 2019 |
Model | SM8550-AB MediaTek Dimensity 1000 |
Class | Flagship Flagship |
Size | 4nm 7nm |
Cores | 8 8 |
CPU Configuration |
1 Prime core x 3.2 GHz ARM Cortex-X3 & 4 x 2.8 GHz Cortex-A715 and 3x2.0 GHz Cortex-A510
4x 2.6 GHz – Cortex-A77 4x 2 GHz – Cortex-A55 |
High Frequency | 3200 MHz 2600 MHz |
Performance Core | 1 Prime core x 3.2 GHz ARM Cortex-X3 4x 2.6 GHz – Cortex-A77 |
Power Efficient Core | 3x2.0 GHz Cortex-A510 4x 2 GHz – Cortex-A55 |
Core architecture | hybrid (Prime / big.LITTLE) hybrid (big.LITTLE) |
Instruction set | ARMv9-A ARMv8-A64 (64 bit) |
L2 cache | 1 MB |
L3 cache | 8 MB |
Thermal Design Power (TDP) | 10W |
Storage Type | UFS 4.0 UFS 2.2, UFS 3.0 |
GPU | Adreno 740 ARM Mali-G77 MC9 |
GPU frequency | 1.00 GHz 850 MHz |
GPU Architecture | Adreno 700 Valhall |
FLOPS | 3000 800 |
OpenCL Version | 2.0 2.0 |
DirectX Support | 12 12 |
Vulkan version | 1.3 1.1 |
Shading units | 144 |
Video Encoding |
Hybrid Log Gamma (HLG), HDR10+, AV1, H.264 (Advanced Video Coding (AVC)), VP9, VP8, Dolby Vision®, H.265 (High Efficiency Video Coding (HEVC)), HDR10
H.264, H.265 / HEVC |
Video Playback |
Up to 8K @ 60 fps
H.264, H.265 / HEVC, VP-9, AV1 |
Gaming | HDR gaming (10-bit color depth, Rec. 2020 color gamut) • Snapdragon Shadow Denoiser MediaTek HyperEngine 2.0 |
APU / NPU / AI Proc. / Neural IP | Qualcomm® Hexagon™ Processor MediaTek APU 3.0 |
TOPS Speed | - 4.5 TOPS |
Extra Feature |
- First Snapdragon Mobile Platform with hardware-based micro tile inferencing to run complex neural networks - Dual-core AI processor, Always-sensing camera - Qualcomm® Hexagon™ Processor Features: Qualcomm® Hexagon™ Tensor Accelerator, Dedicated power delivery system, Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Micro Tile Inferencing, Fused AI Accelerator architecture, Hexagon Direct Link |
RAM Type | LPDDR5x LPDDR4X |
RAM frequency | 4200 MHz 1866 MHz |
RAM Max | 24 GB 16 GB |
Max Bandwidth | 64 Gbit/s 29.87 Gbit/s |
Bus Speed | 4x 16 Bit 4x 16 Bit |
Cellular Modem | Snapdragon™ X70 5G Modem-RF System Mediatek 5G Modem |
Cellular Technology |
TD-SCDMA, HSPA, sub-6 GHz, FDD, 5G mmWave, NSA (non-standalone), CDMA 1x, EN-DC, EV-DO, CBRS, NR-DC (mmWave-sub6 dual connectivity), TDD, LTE, GSM/EDGE, SA (standalone), SA (standalone) mmWave, WCDMA
2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA |
5G Modem | |
5G Network | 8 carriers (mmWave), 2x2 MIMO (mmWave), 4x4 MIMO (Sub-6) 200 MHz bandwidth, 4x4 MIMO, 256QAM NR UL 2CC, 2x2 MIMO, 256QAM VoNR / EPS fallback |
5G mmWave | |
5G sub-6 GHz | |
Download Speed | Up to 10 Gbps 4.7Gbps |
Upload Speed | Up to 3.5 Gbps 2.5Gbps |
Dual SIM | |
Extra Feature |
Dual SIM Dual Active (DSDA) 5G+5G and 5G+4G, Global 5G Multi-SIM Qualcomm® Smart Transmit 3.0 technology, Qualcomm® AI-Enhanced Signal Boost, Qualcomm® 5G Ultra-Low Latency Suite, Qualcomm® Wideband Envelope Tracking, Qualcomm® 5G AI Suite, Qualcomm® 5G PowerSave Gen 3 |
wireless System | Qualcomm® FastConnect™ 7800 Mediatek Wireless System |
Wi-Fi Band | 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac, 802.11ax, 802.11be, 6 GHz, 2.4 GHz, 5 GHz Wi-Fi 6 (a/b/g/n/ac/ax) |
WiFi-5 | |
WiFi-6 | |
WiFi-6E | |
Wi-Fi 7 | |
Download Speed | Up to 5.8 Gbps |
Bluetooth | Bluetooth® 5.3 Bluetooth® 5.1 |
GPS | GLONASS, NavIC, Beidou, GPS, QZSS, Galileo GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC |
USB | USB-C, USB 3.1 USB-C, USB 3.1 |
NFC | |
Extra Feature |
Features: Passpoint, TDLS, High Band Simultaneous (HBS) Multi-Link, Wi-Fi QoS Management, Wi-Fi Optimized Connectivity, MU-MIMO (UL/DL), Wi-Fi Aware R3, Wi-Fi Location, OFDMA (UL/DL), Miracast, Voice-Enterprise |
ISP | Qualcomm® Spectra™ MediaTek Imagiq ISP |
Single Camera | Up to 108 MP Up to 80MP |
Multi Camera |
Triple Camera (MFNR, ZSL, 30 fps): Up to 36 MP Dual Camera (MFNR, ZSL, 30 fps): Up to 64+36 MP 32MP + 16MP Dual Camera |
Video capture | Up to 8K HDR 30fps or 4K 120fps, 720p @ 960 fps Hybrid Log Gamma (HLG), Dolby Vision®, HDR10, HDR10+ 3840 x 2160 |
Video Codec | Dolby Vision, HDR10+, HDR10, HLG, H.264 (AVC), H.265 (HEVC), VP8, VP9 H.264, H.265 / HEVC |
Extra Feature | • Up to 200 Megapixel Photo Capture |
Display Support | 4K @ 60 Hz • QHD+ @ 144 Hz 2520 x 1080 |
Refresh Rate | 144 Hz 144Hz |
Extra Feature |
10-bit color depth, Rec. 2020 color gamut • HDR10, HDR10+, HDR vivid, and Dolby Vision |
Audio Playback | Qualcomm Aqstic™ audio codec Qualcomm Aqstic™ audio codec AAC, AIFF, CAF, MP3, MP4, WAV |
Bluetooth Audio | Bluetooth audio: Snapdragon Sound™ Technology with support for Qualcomm® aptX™ Voice, aptX Lossless, aptX Adaptive, and LE Audio |
Security Features |
Qualcomm® 3D Sonic Sensor Max, Qualcomm® 3D Sonic Sensor Biometric Authentication (Face), Biometric Authentication (Fingerprint), Biometric Authentication (Voice), Biometric Authentication (Iris) Face Unlock and Finger Print Sensor |
Fingerprint Sensor | |
Face Detection |
Charging Speed | Qualcomm® Quick Charge™ 5 technology |
AnTuTu benchmark scores | 1245135 437893 |
Geekbench scores |
Single-Core Score - 1498 Multi-Core Score - 4981 Single-Core - 675 multi-core - 2864 |
3DMark | 13243 |
PCMark | 18915 |