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Qualcomm Snapdragon 680 Vs Dimensity 820

The Qualcomm Snapdragon 680 Vs Dimensity 820 Specification Comparison – These are two processors from Qualcomm and Mediatek known for their exceptional performance and efficiency. Both of these processors have been designed with advanced features and capabilities to provide users with top-notch performance and speed.

You can also check its ranking on the Best Mobile Processor Ranking List. Additionally, you can use our Processor Comparison Tool to compare any processor to another.

Qualcomm Snapdragon 680 Vs Dimensity 820 Specification Comparison

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Info

Manufacturer Qualcomm Mediatek
Announced 27 October, 2021 18 May, 2020
Model SM6225 MT6875
Class Low end Mid range

CPU

Size 6nm 7nm
Cores 8 8
CPU Configuration 4x 2.4 GHz – Kryo 265 Gold (Cortex-A73)
4x 1.9 GHz – Kryo 265 Silver (Cortex-A53)
4x 2.6 GHz – Cortex-A76 and 4x 2 GHz – Cortex-A55
High Frequency 2400 MHz 2600 MHz
Performance Core 4x 2.4 GHz – Kryo 265 Gold (Cortex-A73) 4x 2.6 GHz – Cortex-A76
Power Efficient Core 4x 1.9 GHz – Kryo 265 Silver (Cortex-A53) 4x 2 GHz – Cortex-A55
Core architecture hybrid (big.LITTLE) hybrid (big.LITTLE)
Instruction set ARMv8.2-A ARMv8-A64 (64 bit)
Thermal Design Power (TDP) 10W
Storage Type eMMC, UFS 2.2 UFS 2.1

GPU

GPU Adreno 610 ARM Mali-G57 MC5
GPU frequency 950 MHz 650 MHz
GPU Architecture Adreno 600 Valhall
FLOPS 243 Gigaflops
OpenCL Version 2.0 2.0
DirectX Support 12 12
Vulkan version 1.1 1.1
Shading units 128 80
Video Encoding H.264 (Advanced Video Coding (AVC)), VP9, VP8, H.265 (High Efficiency Video Coding (HEVC)) H.264, H.265 / HEVC

Video Playback Up to 1080p @ 60 fps

H.264 (Advanced Video Coding (AVC)), VP9, VP8, H.265 (High Efficiency Video Coding (HEVC))
H.264, H.265 / HEVC, VP-9

Gaming MediaTek HyperEngine 2.0

NPU

APU / NPU / AI Proc. / Neural IP Qualcomm® Hexagon™ 686 MediaTek APU 3.0

Memory

RAM Type LPDDR4X LPDDR4X
RAM frequency 2133 MHz 2133 MHz
RAM Max 8 GB 16 GB
Max Bandwidth 17 Gbit/s 17.07 Gbit/s
Bus Speed 2x 16 Bit 2x 16 Bit

Connectivity

Cellular Modem Qualcomm® Snapdragon™ X11 LTE modem Mediatek 5G Modem
Cellular Technology TD-SCDMA, LTE TDD support for CBRS, LTE TDD, CDMA 1x, EV-DO, GSM/EDGE, LTE FDD, WCDMA (DC-HSDPA), WCDMA (DC-HSUPA)

2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA

5G Modem
5G Network 100 MHz bandwidth, 4x4 MIMO, 256QAM NR UL 2CC, 2x2 MIMO, 256QAM VoNR / EPS fallback
5G mmWave
5G sub-6 GHz
Download Speed Up to 390 Mbps
Upload Speed Up to 150 Mbps
Dual SIM

Wireless System

wireless System Qualcomm® FastConnect™ 6100 Mediatek Wireless System
Wi-Fi Band 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac Wi-Fi 5 (a/b/g/n/ac)
WiFi-5
WiFi-6
WiFi-6E
Wi-Fi 7
Bluetooth Bluetooth® 5.1 Bluetooth® 5.1
GPS GLONASS, NavIC, Beidou, GPS, QZSS, Galileo GPS L1CA / BeiDou B1I / Glonass L1OF / Galileo E1 / QZSS L1CA
USB USB-C USB-C, USB 3.1
NFC

ISP

ISP Qualcomm® Spectra™ 346 Mediatek ISP
Single Camera Up to 64 MP Up to 80MP
Multi Camera 13+13+5 MP triple camera
16+16 MP dual camera
32MP + 16MP Dual Camera
Video capture 1080p @ 60 FPS 3840 x 2160

Video Codec H.265 (High Efficiency Video Coding (HEVC)) H.264, H.265 / HEVC

Display and Audio Support

Display Support • FHD+ (1080 x 2520 @ 90 Hz) • HD+ (900 x 1600 @ 90 Hz) 2520 x 1080
Refresh Rate 90Hz 120 Hz
Audio Playback AAC, AIFF, CAF, MP3, MP4, WAV AAC, AIFF, CAF, MP3, MP4, WAV
Bluetooth Audio Qualcomm Aqstic™ audio codec up to Qualcomm® WCD9385

Security

Security Features Secure Boot, HW Crypto Cores, Qualcomm® Trusted Execution Environment (TEE), Trusted UI Framework, Widevine™ L1 V15 DRM, Debug Security, Qualcomm® Content Protection Framework, HW/SW storage security, HW/SW Key Management Finger Print sensor and Face Unlock
Fingerprint Sensor
Face Detection

Charging

Charging Speed Qualcomm® Quick Charge™ 3.0 technology

Benchmarks

AnTuTu benchmark scores 269430 445749
Geekbench scores Single-Core Score - 373
Multi-Core Score - 1548
Single-Core Score - 519
Multi-Core Score - 2382
3DMark 441 2350
  Qualcomm Snapdragon 680 Mediatek Dimensity 820

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