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Qualcomm Snapdragon 460 Vs Dimensity 820

The Qualcomm Snapdragon 460 Vs Dimensity 820 Specification Comparison – These are two 8-core processors from Qualcomm and Mediatek known for their exceptional performance and efficiency. Both of these processors have been designed with advanced features and capabilities to provide users with top-notch performance and speed.

You can also check its ranking on the Best Mobile Processor Ranking List. Additionally, you can use our Processor Comparison Tool to compare any processor to another.

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  Qualcomm Snapdragon 460 HiSilicon Kirin 820
Price
Our Rating 2.5 5.2
Brand Qualcomm Huawei
Category Processor Processor

Info

Manufacturer Qualcomm Huawei
Announced 21 January, 2020 30 March, 2020
Model SM4250-AA Kirin 820
Class Low end Mid range

CPU

Size 11nm 7nm
Cores 8 8
CPU Configuration 4x 1.8 GHz – Kryo 240 Gold and 4x 1.8 GHz – Kryo 240 Silver 1x 2.36 GHz – Cortex-A76, 3x 2.22 GHz – Cortex-A76, 4x 1.84 GHz – Cortex-A55
High Frequency 1800 MHz 2360 MHz
Performance Core 4x 1.8 GHz – Kryo 240 Gold 1x 2.36 GHz – Cortex-A76
Power Efficient Core 4x 1.8 GHz – Kryo 240 Silver 4x 1.84 GHz – Cortex-A55
Core architecture hybrid (big.LITTLE) hybrid (big.LITTLE)
Instruction set ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
Thermal Design Power (TDP) 3 W 5 W
Storage Type UFS 2.1 UFS 2.1

GPU

GPU Qualcomm® Adreno™ 610 ARM Mali-G57 MP6
GPU frequency 600 MHz 850 MHz
GPU Architecture Adreno 600 Valhall
FLOPS 273 Gigaflops 579
OpenCL Version 2.0 2.0
DirectX Support 12 12
Vulkan version 1.1 1.1
Shading units 256 96
Video Encoding H.264, H.265, VP8, VP9 H.264, H.265, AV1, VP9
Video Playback H.264 (AVC), H.265 (HEVC) VP8 and VP9 playback 4K at 30FPS, H.264, H.265, AV1, VP9
Gaming Kirin Gaming+ 2.0

NPU

APU / NPU / AI Proc. / Neural IP Qualcomm® Hexagon™ 683 HUAWEI Da Vinci Architecture

Memory

RAM Type LPDDR4X LPDDR4X
RAM frequency 1866 MHz, 933 MHz 2133 MHz
RAM Max 8 GB 12 GB
Max Bandwidth 13.91 Gbit/s 31.78 Gbit/s
Bus Speed 2x 16 Bit 4x 16 Bit

Connectivity

Cellular Modem Qualcomm® Snapdragon™ X11 LTE modem Balong 5000
Cellular Technology TD-SCDMA, LTE TDD, CDMA 1x, EV-DO, WCDMA (HSUPA), GSM/EDGE, LTE FDD, WCDMA (DC-HSDPA) GSM / HSPA / LTE / 5G
5G Modem
5G Network SA&NSA fusion network architecture, • FDD&TDD Spectrum Access, DSDS3.x
5G mmWave
5G sub-6 GHz
Download Speed Up to 390 Mbps Up to 1200 Mbps
Upload Speed Up to 150 Mbps Up to 200 Mbps
Dual SIM

Wireless System

wireless System Qualcomm FastConnect 6100 Huawei Wireless System
Wi-Fi Band 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac, 802.11ax (ready) Wi-Fi 6 (a/b/g/n/ac/ax)
WiFi-5
WiFi-6
WiFi-6E
Wi-Fi 7
Bluetooth Bluetooth® 5.1 Bluetooth® 5.1
GPS NavIC, GNSS GLONASS, Beidou, GPS, QZSS, Galileo
USB USB-C USB-C, USB 3.1
NFC

ISP

ISP Qualcomm® Spectra™ 340 Kirin ISP 5.0
Single Camera Up to 48 MP 48MP
Multi Camera Up to 16 MP dual camera 20MP + 20MP
Video capture 1080p Video Capture @ 60 FPS 4K at 30FPS
Video Codec H.264, H.265, VP8, VP9 H.264, H.265, AV1, VP9

Display and Audio Support

Display Support FHD+ (1080 x 2520 @ 60 Hz), HD+ (900 x 1600 @ 90 Hz 3360 x 1440
Refresh Rate 90 Hz 120Hz
Audio Playback Qualcomm Aqstic™ audio codec up to WCD9370, Qualcomm TrueWireless™ Technology AAC, AIFF, CAF, MP3, MP4, WAV
Bluetooth Audio Channel Utilization: 20/40/80 MHz • MIMO Configuration: 1x1 • 8-stream sounding, MU-MIMO • Target Wake Time (TWT) • Wi-Fi Security: WPA3-Enterprise, WPA3-Enhanced Open, WPA3 Easy Connect, WPA3-Personal

Security

Security Features Secure Processing Unit (SPU): Biometric Authentication (Face), Biometric Authentication (Fingerprint), Biometric Authentication (Voice), Biometric Authentication (Iris)

Face Unlock and Finger Print Sensor
Fingerprint Sensor
Face Detection

Charging

Charging Speed Qualcomm® Quick Charge™ 3.0 technology

Benchmarks

AnTuTu benchmark scores 165021 445853
Geekbench scores Single-Core Score - 253
Multi-Core Score - 1146
Single-Core Score - 638
Multi-Core Score - 2442
3DMark 241
  Qualcomm Snapdragon 460 HiSilicon Kirin 820

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