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Qualcomm Snapdragon 460 Vs Dimensity 1050
The Qualcomm Snapdragon 460 Vs Dimensity 1050 Specification Comparison – These are two 8-core processors from Qualcomm and Mediatek known for their exceptional performance and efficiency. Both of these processors have been designed with advanced features and capabilities to provide users with top-notch performance and speed.
You can also check its ranking on the Best Mobile Processor Ranking List. Additionally, you can use our Processor Comparison Tool to compare any processor to another.
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Info
Manufacturer
|
Qualcomm
Mediatek
|
Announced
|
21 January, 2020
23 May, 2022
|
Model
|
SM4250-AA
Dimensity 1050
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Class
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Low end
Midrange
|
CPU
Size
|
11nm
6nm
|
Cores
|
8
8
|
CPU Configuration
|
4x 1.8 GHz – Kryo 240 Gold and 4x 1.8 GHz – Kryo 240 Silver
2x 2.5 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
|
High Frequency
|
1800 MHz
2500 MHz
|
Performance Core
|
4x 1.8 GHz – Kryo 240 Gold
2x 2.5 GHz – Cortex-A78
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Power Efficient Core
|
4x 1.8 GHz – Kryo 240 Silver
6x 2 GHz – Cortex-A55
|
Core architecture
|
hybrid (big.LITTLE)
hybrid (big.LITTLE)
|
Instruction set
|
ARMv8-A64 (64 bit)
ARMv8.2-A
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Thermal Design Power (TDP)
|
3 W
|
Storage Type
|
UFS 2.1
UFS 2.1, UFS 3.1
|
GPU
GPU
|
Qualcomm® Adreno™ 610
ARM Mali-G610 MC3
|
GPU frequency
|
600 MHz
1000 MHz
|
GPU Architecture
|
Adreno 600
Valhall 3
|
FLOPS
|
273 Gigaflops
|
OpenCL Version
|
2.0
2.0
|
DirectX Support
|
12
12
|
Vulkan version
|
1.1
1.1
|
Shading units
|
256
|
Video Encoding
|
H.264, H.265, VP8, VP9
H.265 / HEVC H.264
|
Video Playback
|
H.264 (AVC), H.265 (HEVC) VP8 and VP9 playback
H.265 / HEVC H.264 MPEG-1/2/4 VP-9
|
NPU
APU / NPU / AI Proc. / Neural IP
|
Qualcomm® Hexagon™ 683
MediaTek APU 550
|
Memory
RAM Type
|
LPDDR4X
LPDDR5
|
RAM frequency
|
1866 MHz, 933 MHz
3200 MHz
|
RAM Max
|
8 GB
16 GB
|
Max Bandwidth
|
13.91 Gbit/s
|
Bus Speed
|
2x 16 Bit
4x 16 Bit
|
Connectivity
Cellular Modem
|
Qualcomm® Snapdragon™ X11 LTE modem
Mediatek 5G Modem
|
Cellular Technology
|
TD-SCDMA, LTE TDD, CDMA 1x, EV-DO, WCDMA (HSUPA), GSM/EDGE, LTE FDD, WCDMA (DC-HSDPA)
Sub-6GHz (FR1), mmWave (FR2), 2G-5G Multi-Mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM
|
5G Modem
|
|
5G Network
|
3CC up to 200 MHz, FR2 DL 4CC up to 400MHz, 256QAM FR1 UL 2CC, 256QAM VoNR / EPS fallback
|
5G mmWave
|
|
5G sub-6 GHz
|
|
Download Speed
|
Up to 390 Mbps
|
Upload Speed
|
Up to 150 Mbps
|
Dual SIM
|
|
Wireless System
wireless System
|
Qualcomm FastConnect 6100
Mediatek Wireless System
|
Wi-Fi Band
|
802.11a, 802.11b, 802.11g, 802.11n, 802.11ac, 802.11ax (ready)
Wi-Fi 6E (a/b/g/n/ac/ax)
|
WiFi-5
|
|
WiFi-6
|
|
WiFi-6E
|
|
Wi-Fi 7
|
|
Bluetooth
|
Bluetooth® 5.1
Bluetooth® 5.2
|
GPS
|
NavIC, GNSS
GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC
|
USB
|
USB-C
USB-C, USB 3.1
|
NFC
|
|
ISP
ISP
|
Qualcomm® Spectra™ 340
|
Single Camera
|
Up to 48 MP
Up to 108MP
|
Multi Camera
|
Up to 16 MP dual camera
20MP + 20MP Dual Camera
|
Video capture
|
1080p Video Capture @ 60 FPS
3840 x 2160
|
Video Codec
|
H.264, H.265, VP8, VP9
H.265 / HEVC H.264
|
Display and Audio Support
Display Support
|
FHD+ (1080 x 2520 @ 60 Hz), HD+ (900 x 1600 @ 90 Hz
2520 x 1080
|
Refresh Rate
|
90 Hz
144Hz
|
Audio Playback
|
Qualcomm Aqstic™ audio codec up to WCD9370, Qualcomm TrueWireless™ Technology
AAC, AIFF, CAF, MP3, MP4, WAV
|
Bluetooth Audio
|
Channel Utilization: 20/40/80 MHz • MIMO Configuration: 1x1 • 8-stream sounding, MU-MIMO • Target Wake Time (TWT) • Wi-Fi Security: WPA3-Enterprise, WPA3-Enhanced Open, WPA3 Easy Connect, WPA3-Personal
|
Security
Security Features
|
Secure Processing Unit (SPU): Biometric Authentication (Face), Biometric Authentication (Fingerprint), Biometric Authentication (Voice), Biometric Authentication (Iris)
Fingerprint and Face Unlock
|
Fingerprint Sensor
|
|
Face Detection
|
|
Charging
Charging Speed
|
Qualcomm® Quick Charge™ 3.0 technology
|
Benchmarks
AnTuTu benchmark scores
|
165021
524005
|
Geekbench scores
|
Single-Core Score - 253
Multi-Core Score - 1146
Single-Core Score - 757
Multi-Core Score - 2153
|
3DMark
|
241
2506
|